What Factors Have Caused Problems with Industrial Aluminum Profile Molds
Author： WJW Aluminum Window Manufacturers
In the process of processing and manufacturing industrial aluminum profiles, we need some molds to create different styles of aluminum profiles. However, when designing aluminum profile molds, the designer will have unreasonable design. This requires the designer to measure accurate data before designing to reduce the occurrence of errors. 1. The cooling speed of the molding industrial aluminum profile mold. The temperature of cooling water often does not attract enough attention. The role of cooling water is to stretch the large molecular chain of the profile in time to cool down in time to achieve the purpose of use. 2. For the decline in performance caused by poor divergent tendons, the combination length of tendon and outer surface, tendon and tendon should be appropriately increased, or the compression ratio should be increased to solve the problem. 3. The uneven discharge of industrial aluminum profile molds lead to inconsistent wall thickness or inconsistent density. This causes different mechanical properties on both sides of the profile. Sometimes we pass through cold stamping and fail in the experiment, which just proves this. As for non -standard profiles such as thin walls, I won't say much here. 4. Insufficient pressure of industrial aluminum -type molds. The pressure at the mold is determined by the compression ratio of the mold, especially the length of the industrial aluminum profile mold.
If the mold compression ratio is too small or the straight cross section is too short, the product will not be dense, which will affect physical performance.
On the one hand, the flow resistance can be adjusted by changing the length of the mold segment; on the other hand, in the mold design stage, you can choose different compression ratios to change the extrusion pressure, but you must pay attention to Compression ratio; melt pressure can also be changed by changing the formula, adjusting the extrusion process parameters, and adding porous boards.
